Recruiter

P&C Recruitment Ltd

Salary

Competitive + bonus + php + pension + reloc package + more

Location

Cambridge

Job term

Permanent

Job hours

Full time

Major bluechip Electronics Company now needs a Principal Packaging Engineer Cambs Highly Competitive salary and first class bens package.


Job Title Principal Engineer, Advanced Packaging

Function Operations

Job Purpose

The primary job purpose of this position is to ensure that the Client supply base is equipped with the advanced packaging technology necessary to deliver the Client's roadmap with the correct quality, capability, capacity, & cost. This role is scoped to look at next generation manufacturing requirements over an ongoing 3-5 year timeframe.

Key Responsibilities

· Develop an advanced packaging roadmap in conjunction with Development, R&I, Operations and the Client's Business Units covering the businesses long term (3~5 years) objectives and product requirements· Differentiate Client from its competitors via the development of world class package technology & IP working to protect this IP via patents and other methods where appropriate· Ensure the advanced packaging process technologies are sufficiently robust to meet Client supply requirements including alternate sourcing availability and the capability to be manufactured in multiple locations· Liaise with suppliers (e.g. TSMC & ASE), Academia, & Research Consortia (e.g. SEMATECH & IMEC) to understand advanced packaging technology offerings, schedules and options· Working with APTD, R&I, Operations, Development & other Client groups to manage the design, processing and characterisation of test chips and demonstrators to silicon verify advanced package technology offerings including where applicable Client specific IP blocks. This should include where appropriate passive &/or active device design/development & characterisation. The focus of this position will be on the development of package technologies including but not limited to Through Silicon Via (TSV), Mechanical Electrical Mechanical Systems (MEMS), Integrated Passive Devices (IPD), & various multi-chip module approaches· Assist/support in the tape-out activities for new technologies· Act as a packaging troubleshooting consultant, as called upon, to ensure continuity of supply· Manage generation and filing of patents for new devices/technologies and process options where applicable· Working with peers within APTD to align product roadmaps to technology offerings – manage trade-offs· Manage annual packaging project budget to achieve the Advanced Packaging Technology goals and objectives within company expenditure guidelines· Build and nurture strong relationships with Client’s sub-contractors· Maintain on-going quarterly advanced packaging technology review meetings reviewing sub-contractor advanced process technology offering schedules, performance & alignment to Client’s requests & requirements

Person Specification - Required

· Post-graduate higher degree or equivalent industrial experience· Industry proven hands-on experience with in depth knowledge of packaging technologies,· In depth knowledge of advanced packaging technology including, but not limited to, process technology & design rules· Statistical analysis skills· Design rule rationale & trade-offs· Knowledge of next generation packaging techniques including process integration challenges & solutions· Good understanding of package technologies, wireless markets and customers.· Understanding of advanced node BEOL integration schemes including challenges & solutions· Excellent problem solving skills· Demonstrated ability to lead multi-functional & inter-departmental small & large teams· Proven organisational skills· Strong written & verbal communication and presentation skills· Proven ability to work autonomously

Person Specification - Desired

· Knowledge of Mechanical Electrical Mechanical Systems (MEMS)· Knowledge of advanced CMOS technologies· Knowledge of Analog & RF passives – example MOM/MIM capacitor & inductor· Knowledge of Copper/Low k process integration of advanced CMOS technologies· Knowledge of dual & single copper damascene integration

Interested? Then please send your CV to me for the Principal Packaging Engineer Cambs vacancy on the email address in this advert. Your CV WILL NOT be sent anywhere without your prior consent.

N.B. This company will sponsor for work permits but you must have sufficient points and all necessary documentation to support the application